EANS-News: DEWB investment holding KSW Microtec showcases new generation Thinlam® at ICMA EXPO

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Corporate news transmitted by euro adhoc. The issuer/originator is solely
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Dresden, Germany, April 27, 2010 (euro adhoc) - KSW Microtec, one of the world´s
leading suppliers of RFID components and inlays for secure cards and other form
factors, will be highlighting its new generation of thinnest RFID prelaminates
for eGovernment, ePayment and high security applications at ICMA EXPO from May
2nd to 5th.

Along with its industry partner, AreCon, a consulting firm for smart card
manufacturers and a distributor of premium semi-finished smart card products,
KSW Microtec will provide visitors an insight into its manufacturing expertise
which brings unrivalled innovations to market, such as its latest and proven
polycarbonate prelaminate, Thinlam®. This innovative family of inlays enables
the implementation of a variety of additional card layers for security features
without exceeding the allowed card thickness.

Thinlam® particularly targets governments, financial institutions and other
high-security conscious institutions who constantly demand additional security
features on all forms of ID cards, financial cards and documents for
authentication, validation and access. In order to achieve this increasing need,
multiple foil layers need to be added and large memory security microcontrollers
need to be incorporated into cards and documents, while maintaining ISO
standards for maximum card thickness - and Thinlam® with a thickness of 270µm is
fit for purpose.

Today, given its proven capabilities, Thinlam® is used in passports, driver´s
licenses and ID cards as well as for e-payment applications worldwide. Since the
prelaminate is available in volume - and used in volume, issuers are guaranteed
availability, durability and reliability.

As both sides of the card are fully opaque executable, both the chip and the
antenna are visually screened. Therefore any potential deformation areas on the
card are avoided when using KSWs Thinlam®. Other common restrictions regarding
visual card personalization are eliminated, allowing for new features to be
applied above the chip area of the card if required. Furthermore, electrical and
mechanical performance, such as electrical parameter stability, is enhanced.
Thinlam® is available in polycarbonate, PVC, PET or Teslin® and can also be used
for transparent RFID cards due to the excellent optical appearance.

At ICMA EXPO, KSW Microtec will showcase further new and innovative products
besides Thinlam®, such as its mobile phone sticker for contactless payment
applications. The company´s collaboration with AreCon, who represents companies
such as PET foil manufacturers Agfa Materials, high security software developers
for card applications Monet+ and AdvanIDe, will add value for all those
attending ICMA EXPO. Both companies look forward to welcoming their partners and
customers to the show and sharing their expert insights on technological and
business developments and opportunities in both existing and emerging markets
for advanced card security.

Visit KSW Microtec at ICMA EXPO, Marriott Camelback Inn, Scottsdale, Arizona, on
Booth 3

About KSW
KSW Microtec AG, with its headquarters in Germany, is the world´s leading
supplier of RFID (Radio Frequency Identification) components for applications
such as eTicketing, ePayment, Asset Management, Access Control and High
Security. KSW combines successful high-end wafer processing, extremely efficient
assembly technology and far-reaching expertise in design. KSW has earned itself
a leading position on the market as one of the most efficient, and
simultaneously most flexible, producers of RFID components. The globally active
company was founded in 1994 and has clean room production facilities in Germany.
KSW is an investment holding of the listed venture capital company Deutsche
Effecten- und Wechsel-Beteiligungsgesellschaft AG (DEWB) headquartered in Jena.
For more information see: www.ksw-microtec.de

For further information, please contact:

Sandra Jaunich
KSW Microtec AG
Manfred-von-Ardenne-Ring 12
01099 Dresden - Germany
Tel: +49 351 889 60 28
Fax: +49 351 889 60 11
[email protected]
www.ksw-microtec.de

Media contact:
Tim Cockerell
Wise Media S.p.A.
Via Lepetit 4
20124 Milano - Italy
Tel: +39 02 8903 4126
Fax: +39 02 67388322
[email protected]
www.wisemedia.com

Further inquiry note:
Marco Scheidler
Tel.: +49 (0) 3641 573-3600
E-Mail: [email protected]
end of announcement euro adhoc
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issuer: Deutsche Effecten- und Wechsel-Beteiligungsges. AG
Leutragraben 1
D-07743 Jena
phone: +49 (0)3641 573 3600
FAX: +49 (0)3641 573 3610
mail: [email protected]
WWW: http://www.dewb-vc.com
sector: Financial & Business Services
ISIN: DE0008041005
indexes: CDAX, Classic All Share
stockmarkets: free trade: Berlin, Stuttgart, München, regulated dealing/general
standard: Frankfurt
language: English

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