EQS-News: ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing connectorized multi-core fiber solution and expanding ecosystem network

EQS-News: ams-OSRAM AG / Key word(s): Miscellaneous
   ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing
   connectorized multi-core fiber solution and expanding ecosystem network

   21.09.2026 / 10:00 CET/CEST
   The issuer is solely responsible for the content of this announcement.

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   ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing
   connectorized multi-core fiber solution and expanding ecosystem network

    

   Moving data efficiently is becoming one of the defining challenges of
   next-generation AI systems. As AI clusters continue to scale, optical
   interconnects are emerging as critical technology for enabling higher
   bandwidth at significantly lower power consumption.

     • Expanding ams OSRAM's Digital Photonics Interconnects platform into AI
       scale-up through a growing ecosystem of industry partners
     • Introducing next-generation 850nm Thin-Film microVCSEL arrays with
       addressability enabling highly parallel "wide-and-slow" optical
       architectures
     • Demonstrating error-free 32 Gb/s operation with approximately 0.25
       pJ/bit energy efficiency and more than 2,000 hours reliability
       validation
     • Showcasing a connectorized multi-core fiber solution with ecosystem
       partner BizLink

    

   Premstaetten, Austria, and Munich, Germany (21 September 2026) – ams OSRAM
   unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing
   connectorized multi-core fiber solution and expanding ecosystem network.

   As artificial intelligence continues to drive unprecedented growth in
   computing infrastructure, moving data efficiently is becoming just as
   critical as processing it. The increasing scale of AI training and
   inference clusters is placing new demands on optical interconnect
   technologies, requiring higher bandwidth, lower latency and significantly
   improved power efficiency.

   ams OSRAM is expanding its Digital Photonics strategy to address this
   emerging opportunity. Building on its leadership in intelligent light
   emitters, optical sensors and advanced semiconductor manufacturing and
   assembly, the company is unveiling key photonic building blocks required
   for next-generation AI infrastructure. These include addressable
   micro-emitter arrays based on both LED and VCSEL technologies, as well as
   matching micro-photodiode arrays that together form the optical foundation
   of future ultra-high-bandwidth interconnect architectures.

   At ECOC 2026 in Malaga, ams OSRAM will unveil its latest breakthrough in
   Thin-Film VCSEL technology and demonstrate a connectorized multi-core
   fiber solution in collaboration with BizLink, maturing the ecosystem for
   highly parallel, ultra-low-power optical interconnects for AI Scale-up.

   Building a Wide-and-Slow Ecosystem for AI Infrastructure

   Following the strategic customer cooperation announced earlier this year
   with a confidential industry partner, ams OSRAM continues to broaden its
   ecosystem for wide-and-slow optical interconnect architectures.

   The company is collaborating with multiple partners across the value
   chain, including testing, fiber infrastructure, connector technologies,
   packaging and system integration, with the objective of accelerating
   industry adoption of next-generation optical interconnect solutions.

   BizLink joins this growing ecosystem as a specialist in optical
   connectivity and connector solutions and is supporting the development of
   the ECOC 2026 demonstrator.

   From Adaptive Headlamps to AI Data Movement

   The foundations of ams OSRAM's optical interconnect technology were
   established long before the emergence of today's AI infrastructure market.

   ams OSRAM's optical interconnect technology builds upon the same core
   technology platform that enabled the successful commercialization of
   EVIYOS™, one of the industry's most advanced digital lighting solutions.

   Combining highly addressable micro-emitter arrays, CMOS integration,
   wafer-level manufacturing know-how and advanced packaging technologies,
   EVIYOS™ has demonstrated the scalability and manufacturability of ams
   OSRAM's Digital Photonics platform in high-volume production. The platform
   has also proven ams OSRAM's ability to serve demanding markets requiring
   consistent quality, reliability and production scalability across millions
   of devices.

   The same technology principles are now being extended into AI
   infrastructure as well as mobile/wearable applications. What began as a
   highly addressable micro-emitter architecture for adaptive headlamps is
   evolving into a photonics platform capable of moving data with exceptional
   energy efficiency and scalability.

   Re-thinking Optical Interconnects with Wide-and-Slow Architectures

   The rapid scaling of AI clusters is reshaping requirements for
   intra-datacenter connectivity. Future AI scale-up networks will require
   interconnects that simultaneously optimize power consumption, latency,
   density, reliability and cost.

   ams OSRAM is targeting this challenge through a highly parallel
   wide-and-slow optical architecture. Instead of transmitting increasing
   amounts of data through a limited number of highly complex channels, data
   is distributed across a large number of lower-speed optical lanes.
   Realizing such highly parallel architecture also requires corresponding
   advances in fiber and connector technologies, highlighting the critical
   importance of the ams OSRAM and BizLink partnership.

   This approach reduces overall system complexity while enabling lower
   latency, lower power consumption and scalable bandwidth growth. As AI
   clusters continue to expand, wide-and-slow architecture offers a promising
   path toward more sustainable and cost-efficient infrastructure.

   Breakthrough Thin-Film microVCSEL Platform for AI Scale-Up Networks

   ams OSRAM continues to expand its photonics portfolio through the
   development of a next-generation 850 nm Thin-Film VCSEL platform
   specifically designed for AI scale-up interconnects.

   The platform combines several differentiating technologies in a single
   architecture, including top-emission Thin-Film VCSELs, dense 25 µm pitch
   microVCSEL arrays with addressability, silicon TSV integration and
   compatibility with standard multimode fiber infrastructure. This enables
   highly parallel optical links with exceptional packaging density and
   ultra-low-power operation.

   The company has successfully completed microVCSEL integration on silicon
   TSV substrates and demonstrated error-free 32 Gb/s NRZ operation. The
   platform achieves an energy efficiency of approximately 0.25 pJ/bit while
   maintaining compatibility with scalable manufacturing approaches. This
   level of efficiency highlights the potential of highly parallel optical
   architectures to support future bandwidth scaling while minimizing power
   consumption.

   In addition, reliability testing has shown no failures after more than
   2,000 hours under elevated junction temperatures and current overstress
   conditions.

   Building on these results, ams OSRAM is advancing the development of fully
   integrated 3D photonics stacks combining microVCSEL arrays,
   micro-photodiode arrays and mixed signal CMOS electronics for future
   ultra-high-bandwidth optical interconnect architectures.

   ECOC 2026 Demonstrates High-Speed Operation with a Connectorized Fiber
   Solution

   At ECOC 2026, ams OSRAM will present its most advanced optical
   interconnect demonstrator to date together with BizLink, a leading
   provider of interconnect, fiber-optic connectivity and optical integration
   solutions.

   The demonstrator combines ams OSRAM's 2D addressable 850 nm microVCSEL
   array technology with BizLink's fiber-array integration and optical
   connectivity expertise, creating a connectorized multi-core fiber solution
   optimized for wide-and-slow data communication.

   The system will be demonstrated in a private setting for selected
   customers and industry partners during the event.

   “AI infrastructure requires a fundamentally different approach to moving
   data and wide-and-slow optical architectures deliver a step-change in
   power efficiency, latency and scalability. As an integrated
   electro-optical engine provider, it’s our role to build out the ecosystem
   required to support a scalable industry solution, and we’re excited about
   our partnership with BizLink to enable fiber connectivity solutions.” said
   Ashkan Seyedi, Vice President and General Manager of Optical Interconnects
   at ams OSRAM.

   “This demonstrator validates a fundamentally different optical
   interconnect architecture optimized for ultra-low power and low latency
   operation, by combining ams OSRAM's addressable microVCSEL technology with
   BizLink's expertise in fiber-array integration, optical packaging and
   manufacturing, we have demonstrated the potential of highly parallel
   optical interconnects for future AI infrastructure.” said Hendrik
   Coldenstrodt, CTO of the Computing and Transportation Business Group at
   BizLink Group.

   ECOC attendees interested in learning more about ams OSRAM's optical
   interconnect developments are invited to visit booth #1281 and attend the
   company's presentations at the Global Photonics Economic Forum (GPEF
   2026).

   Additional information on Optical Interconnects and ams OSRAM’s AI
   photonics technology can be found on the company’s dedicated [1]technology
   page.

    

    

    

    

   About ams OSRAM

   The ams OSRAM Group (SIX: AMS) is a global leader in innovative light and
   sensor solutions. As a specialist in Digital Photonics, we combine
   engineering excellence with cutting-edge global manufacturing to offer our
   customers the broadest portfolio of digital light and sensing
   technologies.

   “Sense the power of light” — our success has ever since been based on a
   deep understanding of the potential of light. For 120 years, we have been
   developing innovations that move markets: from automotive applications and
   industrial manufacturing to medical and consumer electronics. In the
   anniversary year of the OSRAM brand, around 19,000 employees worldwide are
   working on pioneering solutions alongside societal megatrends such as
   smart mobility, artificial intelligence, augmented reality, smart health,
   and robotics. This is reflected in over 12,000 patents granted and applied
   for. Headquartered in Premstaetten/Graz (Austria) with co-headquarters in
   Munich (Germany), the group achieved EUR 3.3 billion revenues in 2025 and
   is listed as ams-OSRAM AG on the SIX Swiss Exchange (ISIN: AT0000A3EPA4). 

   Find out more about us on [2]https://ams-osram.com   

   ams and OSRAM are registered trademarks of ams-OSRAM AG. In addition, many
   of our products and services are registered or filed trademarks of ams
   OSRAM Group. All other company or product names mentioned herein may be
   trademarks or registered trademarks of their respective owners.

   Join ams OSRAM social media channels: [3]>LinkedIn  [4]>YouTube 

   For further information                 
   Investor Relations        Media Relations
   ams-OSRAM AG              ams-OSRAM AG
   Dr Juergen Rebel          Bernd Hops
   Senior Vice President     Senior Vice President
   Investor Relations        Corporate Communications
   T: +43 3136 500-0         T: +43 3136 500-0
   [5][email protected] [6][email protected]
                                           

    

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   21.09.2026 CET/CEST This Corporate News was distributed by [7]EQS Group

   View original content: [8]EQS News

   ══════════════════════════════════════════════════════════════════════════

   Language:    English
   Company:     ams-OSRAM AG
                Tobelbader Straße 30
                8141 Premstaetten
                Austria
   Phone:       +43 3136 500-0
   E-mail:      [email protected]
   Internet:    https://ams-osram.com/
   ISIN:        AT0000A3EPA4
   WKN:         A118Z8
   Listed:      Regulated Unofficial Market in Dusseldorf, Frankfurt,
                Stuttgart; BX
   LEI Code:    5299001JPPT2QFTV5D76
   EQS News ID: 2401946


    
   End of News EQS News Service


   2401946  21.09.2026 CET/CEST

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